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july 2010 doc id 17734 rev 1 1/12 12 2N2484HR hi-rel npn bipolar transistor 60 v - 50 ma features linear gain characteristics hermetic packages escc qualified european preferred part list - eppl description the 2N2484HR is a silicon planar epitaxial npn transistor specifically designed for aerospace hi- rel applications and housed in hermetic packages. it complies with the escc 5000 qualification standard. it is escc qualified according to the 5201-001 specification. in case of conflict between this datasheet and escc detailed specification, the latter prevails. figure 1. internal schematic diagram pin 4 in lcc-3ub connected to the lid (for ground contact) parameter value bv ceo 60 v i c (max) 50 ma h fe at 10 v - 150 ma > 250 operating temperature range - 65 c to + 200 c to-18 lcc-3 3 1 2 lcc-3ub 3 1 2 3 1 2 4 table 1. device summary order codes escc part number quality level packages lead finish mass (g) eppl 2n2484ub1 - engineering model lcc-3ub gold 0.06 - 2n2484ub06 5201/001/06 escc flight lcc-3ub gold 0.06 - 2n2484ub07 5201/001/07 escc flight lcc-3ub solder dip 0.06 - soc2484 - engineering model lcc-3 gold 0.06 - soc2484hrb 5201/001/01 or 02 escc flight lcc-3 gold / solder dip (1) 0.06 - 2N2484HR 5201/001/04 or 05 escc flight to-18 gold / solder dip (1) 0.40 y 1. depending escc part number mentioned on the purchase order. www.st.com
electrical ratings 2N2484HR 2/12 doc id 17734 rev 1 1 electrical ratings table 2. absolute maximum ratings symbol parameter value unit v cbo collector-base voltage (i e = 0) 60 v v ceo collector-emitter voltage (i b = 0) 60 v v ebo emitter-base voltage (i c = 0) 6 v i c collector current 50 ma p tot total dissipation at t amb 25 c 2N2484HR 2n2484ub1 / soc2484hrb 2n2484ub1 / soc2484hrb (1) total dissipation at t c 25 c for 2N2484HR 0.36 0.36 0.73 1.2 w w w w t stg storage temperature - 65 to 200 c t j max. operating junction temperature 200 c 1. when mounted on a 15 x 15 x 0.6 mm ceramic substrate. table 3. thermal data for through-hole package symbol parameter to-18 unit r thjc thermal resistance junction-case __ max 146 c/w r thja thermal resistance junction-ambient __ max 486 c/w table 4. thermal data for smd package symbol parameter lcc-3 / lcc-3ub unit r thja thermal resistance junction-a mbient __ max 486 c/w thermal resistance junction-ambient (1) max 239 1. when mounted on a 15 x 15 x 0.6 mm ceramic substrate.
2N2484HR electrical characteristics doc id 17734 rev 1 3/12 2 electrical characteristics t case = 25 c unless otherwise specified. table 5. electrical characteristics symbol parameter test conditions (1) min. typ. max. unit v (br)cbo collector-base breakdown voltage i c = 10 a 60 - v v (br)ceo (2) collector-emitter breakdown voltage i c = 10 ma 60 - v v (br)ebo emitter-base breakdown voltage i e = 10 a 6 - v i cbo collector-base cut-off current v cb = 45 v - 10 na i cbo emitter-base cut-off current v eb = 5 v - 10 na v ce(sat) (2) collector-emitter saturation voltage i c = 1 ma i b = 0.1 ma - 0.35 v h fe (2) dc forward current transfer ratio i c = 1 a v ce = 5 v i c = 10 a v ce = 5 v i c = 100 a v ce = 5 v i c = 1 ma v ce = 5 v i c = 10 ma v ce = 5 v 30 100 175 250 - 500 550 650 800 h fe high frequency current gain 1 v ce = 5 v i c = 50 a f = 5 mhz 3- high frequency current gain 2 v ce = 5 v i c = 500 a f = 30 mhz 2- c obo output capacitance v cb = 5 v i e = 0 f = 1 mhz -6pf c ibo input capacitance v eb = 0.5 v i c = 0 f = 1 mhz -6pf h fe small signal current gain i c = 1 ma v ce = 5 v f = 1 khz 150 - 900 h ie small signal input impedance i c = 1 ma v ce = 5 v f = 1 khz 3.5 - 24 k h oc small signal output impedance i c = 1 ma v ce = 5 v f = 1 khz -40mho h re small signal reverse voltage transfer ratio i c = 1 ma v ce = 5 v f = 1 khz - 800 10 -6 n fw wide-band noise v ce = 5 v i c = 10 a r s = 10 k -3db
electrical characteristics 2N2484HR 4/12 doc id 17734 rev 1 nf n1 spot noise figure v ce = 5 v i c = 10 a r s = 10 k f = 100 hz power bw = 200 hz -3 db nf n2 v ce = 5 v i c = 10 a r s = 10 k f = 1 khz power bw = 20 hz -10 nf n3 v ce = 5 v i c = 10 a r s = 10 k f = 10 khz power bw = 2 hz -2 1. measurement performed on a sample basis, ltpd 7 or less. 2. pulse measurement: pulse width 300 s, duty cycle 1.0 % table 5. electrical characteristics symbol parameter test conditions (1) min. typ. max. unit table 6. electrical characteristics at high and low temperatures symbol parameter test conditions min. typ. max. unit i cbo collector-base cut-off current v cb = 45 v t amb = 150 c - 10 a h fe2 dc forward current transfer ratio i c = 10 a v ce = 5 v t amb = - 55 c 20 -
2N2484HR test circuit doc id 17734 rev 1 5/12 3 test circuit figure 2. circuit for electrical measurements am07 8 1 8 v1 table 7. list of components component description c1, c2, c5 3.0 - 35 pf c3 (1) 24 pf c4 0.4 - 7.0 pf l1 straight piece n 16 bare tin wire, 5/8 inch long l2 3 turns n 16 wire, 1/4 inch id, 5/16 inch long l3 1 turn n 18 wire, 1/4 inch id, 1/4 inch long l4 ferrite rf choke, z = 450 1. for optimum performance, c3 should be moun ted as close as possible to the base lead.
package mechanical data 2N2484HR 6/12 doc id 17734 rev 1 4 package mechanical data in order to meet environmental requirements, st offers these devices in different grades of ecopack ? packages, depending on their level of environmental compliance. ecopack ? specifications, grade definitions and product status are available at: www.st.com . ecopack ? is an st trademark.
2N2484HR package mechanical data doc id 17734 rev 1 7/12 dim. mm. min. typ. max. a1.16 1.42 c 0.46 0.51 0.56 d 0.56 0.76 0. 9 6 e0. 9 2 1.02 1.12 f1. 9 52.0 3 2.11 g2. 9 2 3 .05 3 .1 8 i 2.41 2.54 2.67 j 0.42 0.57 0.72 k1. 3 7 1.52 1.67 l 0.41 0.51 0.61 m 2.46 2.54 2.62 n1. 8 11. 9 1 2.01 r0.20 r1 0. 3 0 r2 0.56 lcc- 3 ub mechanical data 8 2064 8 7
package mechanical data 2N2484HR 8/12 doc id 17734 rev 1 dim. mm. min. typ. max. a 1.16 1.42 c 0.45 0.50 0.56 d0.600.760. 9 1 e0. 9 11.011.12 f1. 9 52.0 3 2.11 g2. 9 2 3 .05 3 .17 i 2.41 2.54 2.66 j 0.42 0.57 0.72 k1. 3 71.521.67 l 0.40 0.50 0.60 m 2.46 2.54 2.62 n1. 8 01. 9 02.00 r0. 3 0 lcc- 3 mechanical data 0041211 n
2N2484HR package mechanical data doc id 17734 rev 1 9/12
order codes 2N2484HR 10/12 doc id 17734 rev 1 5 order codes contact st sales office for informati on about the specific conditions for: ? products in die form ? tape & reel packing table 8. order codes order codes escc part number packages lead finish marking eppl packing 2n2484ub1 - lcc-3ub gold 2n2484ub1 - waffle pack 2n2484ub06 5201/001/06 lcc-3ub gold 520100106 - waffle pack 2n2484ub07 5201/001/07 lcc-3ub solder dip 520100107 - waffle pack soc2484 - lcc-3 gold soc2484 - waffle pack soc2484hrb 5201/001/01 or 02 lcc-3 gold or solder dip (1) 1. depending escc part number mentioned on the purchase order. 520100101 or 02 - waffle pack 2N2484HR 5201/001/04 or 05 to-18 gold or solder dip (1) 520100104 or 05 y strip pack
2N2484HR revision history doc id 17734 rev 1 11/12 6 revision history table 9. document revision history date revision changes 09-jul-2010 1 initial release
2N2484HR 12/12 doc id 17734 rev 1 please read carefully: information in this document is provided solely in connection with st products. stmicroelectronics nv and its subsidiaries (?st ?) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described he rein at any time, without notice. all st products are sold pursuant to st?s terms and conditions of sale. purchasers are solely responsible for the choice, selection and use of the st products and services described herein, and st as sumes no liability whatsoever relating to the choice, selection or use of the st products and services described herein. no license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. i f any part of this document refers to any third party products or services it shall not be deemed a license grant by st for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoev er of such third party products or services or any intellectual property contained therein. unless otherwise set forth in st?s terms and conditions of sale st disclaims any express or implied warranty with respect to the use and/or sale of st products including without limitation implied warranties of merchantability, fitness for a parti cular purpose (and their equivalents under the laws of any jurisdiction), or infringement of any patent, copyright or other intellectual property right. unless expressly approved in writing by an authorized st representative, st products are not recommended, authorized or warranted for use in milita ry, air craft, space, life saving, or life sustaining applications, nor in products or systems where failure or malfunction may result in personal injury, death, or severe property or environmental damage. st products which are not specified as "automotive grade" may only be used in automotive applications at user?s own risk. resale of st products with provisions different from the statements and/or technical features set forth in this document shall immediately void any warranty granted by st for the st product or service described herein and shall not create or extend in any manner whatsoev er, any liability of st. st and the st logo are trademarks or registered trademarks of st in various countries. information in this document supersedes and replaces all information previously supplied. the st logo is a registered trademark of stmicroelectronics. all other names are the property of their respective owners. ? 2010 stmicroelectronics - all rights reserved stmicroelectronics group of companies australia - belgium - brazil - canada - china - czech republic - finland - france - germany - hong kong - india - israel - ital y - japan - malaysia - malta - morocco - philippines - singapore - spain - sweden - switzerland - united kingdom - united states of america www.st.com

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